Comsol Case Studies Thermal Characterization of an Electronic Device with A Custom App

	Thermal Characterization of an Electronic Device with A Custom App Comsol

Thermal Characterization of an Electronic Device with A Custom App

Comsol

Technology Category	Analytics & Modeling - Predictive Analytics Functional Applications - Remote Monitoring & Control Systems
Applicable Industries	Electronics Professional Service
Applicable Functions	Product Research & Development Quality Assurance
Use Cases	Predictive Maintenance Digital Twin Remote Asset Management
Services	Software Design & Engineering Services System Integration
Challenge	Simulation consultants are using custom applications as an effective way to communicate their work to clients. Instead of delivering a static report, they can now deploy a product that contains the intricacy of an unabridged mathematical model, with the clarity and usability of an app. This lets clients run their simulations independently. At BE CAE & Test, we have created such an app to simulate a surface-mount device (SMD). Whether devices use or convert energy, they must properly manage heat so that they continue to operate in a designated temperature range. An SMD is an example of one electronic system that clients ask us to model. We make use of COMSOL Multiphysics® software to investigate these systems due to the wide range of physics that can be taken into account and the ease with which one can couple them. Read More
About Customer	BE CAE & Test is a simulation consulting firm that leverages high-fidelity multiphysics models to streamline the consulting process. They specialize in creating custom simulation applications that allow clients to independently run simulations. This approach enhances engineering communication by providing clients with user-friendly tools to investigate their systems. BE CAE & Test uses COMSOL Multiphysics® software to model various electronic systems, including surface-mount devices (SMDs), to ensure proper heat management and functionality. Their expertise in numerical simulation and custom app development positions them as a leader in the field of simulation consulting. Read More
Solution	In our SMD model, the parts we're mainly interested in are the copper frame, lead-free solder layer, and the silicon die. The material of the solder layer and silicon die, the thickness of the solder layer, and the dissipated thermal power each have the potential to impact the maximum junction temperatures and junction-to-case thermal resistance. In our model, we investigate the effect of varying these parameters on heat distribution, as it ultimately affects the proper functioning of the SMD. In our test simulation run, the heat source is 15 W, the initial frame temperature is set to 25°C, and the remaining parts are thermally insulated. With COMSOL Multiphysics, it is straightforward to model heat transfer through the device, as all modeling steps are carried out in the same environment. We were able to quickly build the geometry; add materials; use the Heat Transfer in Solids physics interface to set up boundary conditions; mesh; solve; and postprocess the results with the expressions we defined, such as the junction-to-case thermal resistance. Once the COMSOL Multiphysics model is complete, it can be wrapped in a user-friendly interface with the Application Builder tool. As the experts in the physics at hand, we consider both our mathematical model and our client's specifications in order to choose the parameters that the app user can access and modify within an acceptable range. The app user can see the geometry of the SMD, adjust the solder thickness, generate a mesh, launch the simulation, return to default settings, and generate a report. These features are easily created with the functionality available in the COMSOL Application Builder. Read More Log in to view content
Contents

Technology Category

Analytics & Modeling - Predictive Analytics

Functional Applications - Remote Monitoring & Control Systems

Applicable Industries

Electronics

Professional Service

Applicable Functions

Product Research & Development

Quality Assurance

Use Cases

Predictive Maintenance

Digital Twin

Remote Asset Management

Services

Software Design & Engineering Services

System Integration

Challenge

Simulation consultants are using custom applications as an effective way to communicate their work to clients. Instead of delivering a static report, they can now deploy a product that contains the intricacy of an unabridged mathematical model, with the clarity and usability of an app. This lets clients run their simulations independently. At BE CAE & Test, we have created such an app to simulate a surface-mount device (SMD). Whether devices use or convert energy, they must properly manage heat so that they continue to operate in a designated temperature range. An SMD is an example of one electronic system that clients ask us to model. We make use of COMSOL Multiphysics® software to investigate these systems due to the wide range of physics that can be taken into account and the ease with which one can couple them.

About Customer

BE CAE & Test is a simulation consulting firm that leverages high-fidelity multiphysics models to streamline the consulting process. They specialize in creating custom simulation applications that allow clients to independently run simulations. This approach enhances engineering communication by providing clients with user-friendly tools to investigate their systems. BE CAE & Test uses COMSOL Multiphysics® software to model various electronic systems, including surface-mount devices (SMDs), to ensure proper heat management and functionality. Their expertise in numerical simulation and custom app development positions them as a leader in the field of simulation consulting.

Solution

In our SMD model, the parts we're mainly interested in are the copper frame, lead-free solder layer, and the silicon die. The material of the solder layer and silicon die, the thickness of the solder layer, and the dissipated thermal power each have the potential to impact the maximum junction temperatures and junction-to-case thermal resistance. In our model, we investigate the effect of varying these parameters on heat distribution, as it ultimately affects the proper functioning of the SMD. In our test simulation run, the heat source is 15 W, the initial frame temperature is set to 25°C, and the remaining parts are thermally insulated. With COMSOL Multiphysics, it is straightforward to model heat transfer through the device, as all modeling steps are carried out in the same environment. We were able to quickly build the geometry; add materials; use the Heat Transfer in Solids physics interface to set up boundary conditions; mesh; solve; and postprocess the results with the expressions we defined, such as the junction-to-case thermal resistance. Once the COMSOL Multiphysics model is complete, it can be wrapped in a user-friendly interface with the Application Builder tool. As the experts in the physics at hand, we consider both our mathematical model and our client's specifications in order to choose the parameters that the app user can access and modify within an acceptable range. The app user can see the geometry of the SMD, adjust the solder thickness, generate a mesh, launch the simulation, return to default settings, and generate a report. These features are easily created with the functionality available in the COMSOL Application Builder.

Impact #1	Clients can independently run simulations, reducing the need for repeated computational modeling requests.
Impact #2	The custom app allows clients to modify parameters and view outputs quickly, aiding in informed design decisions.
Impact #3	Simulation experts can focus on adding complexity to the models rather than running repetitive simulations.

Impact #1

Clients can independently run simulations, reducing the need for repeated computational modeling requests.

Impact #2

The custom app allows clients to modify parameters and view outputs quickly, aiding in informed design decisions.

Impact #3

Simulation experts can focus on adding complexity to the models rather than running repetitive simulations.

Benefit #1	Heat source set to 15 W in the test simulation run.
Benefit #2	Initial frame temperature set to 25°C in the test simulation run.

Benefit #1

Heat source set to 15 W in the test simulation run.

Benefit #2

Initial frame temperature set to 25°C in the test simulation run.

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Overview

Thermal Characterization of an Electronic Device with A Custom App

Operational Impact

Quantitative Benefit