ANSYS Case Studies Samsung Electronics: Enhancing Thermal Design and Analysis with ANSYS Simulation

	Samsung Electronics: Enhancing Thermal Design and Analysis with ANSYS Simulation ANSYS

Samsung Electronics: Enhancing Thermal Design and Analysis with ANSYS Simulation

ANSYS

Technology Category	Sensors - Infrared Sensors Sensors - Thermal Conductivity Sensors
Applicable Industries	Electrical Grids Electronics
Applicable Functions	Product Research & Development
Use Cases	Intelligent Packaging Virtual Prototyping & Product Testing
Challenge	Samsung Electronics Inc.’s IPT group specializes in the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group is responsible for the analysis of leadframe, ball grid array (BGA), and tape automated bonding (TAB) packages, as well as the development of new package designs. However, as the demand for more complex modules of system-in-package (SIP) and package-on-package (POP) design increases, the need for more accurate and easier-to-use simulation solutions becomes apparent. The challenges faced by the IPT group include detailed modeling, type diversity, maintaining device integrity and its electrical performance, and making thermal software accessible to non-thermal engineers. Read More
About Customer	Samsung Electronics Inc. is a global leader in technology, specializing in the production of a wide range of consumer and industry electronics, including appliances, digital media devices, semiconductors, memory chips, and integrated systems. The company's IPT group is specifically responsible for the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group also handles the analysis of various package designs and is tasked with the development of new package designs. Read More
Solution	Samsung Electronics adopted ANSYS software to address these challenges. ANSYS software can handle various types and kinds of packages by importing the ECAD design file as a prototype. It has a built-in solver that adapts to any new package supporting on-chip distributed power and thermally induced power generation. This leads to a thermally optimal distribution and provides a one-step process from modeling to solving and reporting, making it easier for non-thermal engineers to perform simulations. The software's ability to directly import ECAD drawing files for prototype-intuitive modeling, its fast and accurate solution speed, and its application to various types of packages significantly increased thermal analysis efficiency. Read More Log in to view content
Contents

Technology Category

Sensors - Infrared Sensors

Sensors - Thermal Conductivity Sensors

Applicable Industries

Electrical Grids

Electronics

Applicable Functions

Product Research & Development

Use Cases

Intelligent Packaging

Virtual Prototyping & Product Testing

Challenge

Samsung Electronics Inc.’s IPT group specializes in the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group is responsible for the analysis of leadframe, ball grid array (BGA), and tape automated bonding (TAB) packages, as well as the development of new package designs. However, as the demand for more complex modules of system-in-package (SIP) and package-on-package (POP) design increases, the need for more accurate and easier-to-use simulation solutions becomes apparent. The challenges faced by the IPT group include detailed modeling, type diversity, maintaining device integrity and its electrical performance, and making thermal software accessible to non-thermal engineers.

About Customer

Samsung Electronics Inc. is a global leader in technology, specializing in the production of a wide range of consumer and industry electronics, including appliances, digital media devices, semiconductors, memory chips, and integrated systems. The company's IPT group is specifically responsible for the thermal design and analysis of semiconductor packages. Their main product group includes microprocessors for mobile products, display drive ICs, smart cards, and display panel processors. The IPT group also handles the analysis of various package designs and is tasked with the development of new package designs.

Solution

Samsung Electronics adopted ANSYS software to address these challenges. ANSYS software can handle various types and kinds of packages by importing the ECAD design file as a prototype. It has a built-in solver that adapts to any new package supporting on-chip distributed power and thermally induced power generation. This leads to a thermally optimal distribution and provides a one-step process from modeling to solving and reporting, making it easier for non-thermal engineers to perform simulations. The software's ability to directly import ECAD drawing files for prototype-intuitive modeling, its fast and accurate solution speed, and its application to various types of packages significantly increased thermal analysis efficiency.

Impact #1	The adoption of ANSYS software by Samsung Electronics has led to significant operational improvements. The software's ability to handle various types and kinds of packages has streamlined the process of thermal design and analysis. Its built-in solver adapts to any new package, ensuring optimal thermal distribution. The one-step process from modeling to solving and reporting has made it easier for non-thermal engineers to perform simulations, increasing overall efficiency. Furthermore, the software's fast and accurate solution speed has reduced measurement time, leading to cost savings. Overall, the use of ANSYS software has enhanced the IPT group's ability to guarantee product thermal reliability.

Impact #1

The adoption of ANSYS software by Samsung Electronics has led to significant operational improvements. The software's ability to handle various types and kinds of packages has streamlined the process of thermal design and analysis. Its built-in solver adapts to any new package, ensuring optimal thermal distribution. The one-step process from modeling to solving and reporting has made it easier for non-thermal engineers to perform simulations, increasing overall efficiency. Furthermore, the software's fast and accurate solution speed has reduced measurement time, leading to cost savings. Overall, the use of ANSYS software has enhanced the IPT group's ability to guarantee product thermal reliability.

Benefit #1	Significant increase in thermal analysis efficiency
Benefit #2	Considerable reduction in measurement time
Benefit #3	Significant reduction in expenses

Benefit #1

Significant increase in thermal analysis efficiency

Benefit #2

Considerable reduction in measurement time

Benefit #3

Significant reduction in expenses

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Overview

Samsung Electronics: Enhancing Thermal Design and Analysis with ANSYS Simulation

Operational Impact

Quantitative Benefit