ANSYS
Case Studies
Improving Fuel Cell Reliability: A Case Study of Ballard Power Systems Inc.
Overview
Improving Fuel Cell Reliability: A Case Study of Ballard Power Systems Inc.ANSYS |
Sensors - Infrared Sensors Sensors - Thermal Conductivity Sensors | |
Automotive Life Sciences | |
Outdoor Environmental Monitoring Root Cause Analysis & Diagnosis | |
Hardware Design & Engineering Services | |
Operational Impact
The solution implemented by Ballard Power Systems Inc. had significant operational results. By using thermal-structural coupled field analysis and submodeling, the company was able to pinpoint the primary cause of CVM solder joint failure and solve a major reliability problem. The selection of a new potting material with a suitable coefficient of thermal expansion (CTE) eliminated stress components for the CVM chip and averted failures. This not only improved the reliability of the CVM systems but also the overall reliability of the fuel cell stacks. The new potting material was close to the PCB’s CTE and eliminated the “bulge” of other material tested, reducing peak stress by more than 3X and eliminating the root cause of solder joint failure. The process verified that CVMs potted with the new material showed no sign of solder joint failure, further enhancing the reliability of the company's products. | |
Quantitative Benefit
The process identified the primary cause of CVM solder joint failure, solving a major reliability problem. | |
The selection of a new potting material with a suitable coefficient of thermal expansion (CTE) eliminated stress components for the CVM chip and averted failures. | |
The new potting material reduced peak stress by more than 3X, eliminating the root cause of solder joint failure. | |