Comsol Case Studies Capacitively Coupled Plasma Analysis

	Capacitively Coupled Plasma Analysis Comsol

Capacitively Coupled Plasma Analysis

Comsol

Technology Category	Analytics & Modeling - Digital Twin / Simulation Analytics & Modeling - Predictive Analytics
Applicable Industries	Semiconductors Electronics
Applicable Functions	Product Research & Development
Use Cases	Process Control & Optimization Digital Twin
Services	Software Design & Engineering Services System Integration
Challenge	The multiphysics nature of plasmas presents enormous challenges for numerical simulations; analysis of the CCP process presents added difficulty due to the existence of a plasma sheath, the dynamic behavior of the plasma, and the large number of RF cycles required to reach a periodic steady state. Power deposition into the plasma is highly non-linear and the strong gradient of the electric field in the plasma sheath may lead to numerical instabilities unless a sufficiently fine mesh is applied. Typical CCP reactors may also contain sharp geometric corners that can cause a substantial local electric field that provide unphysical ion fluxes. Read More
About Customer	AltaSim Technologies, based in Columbus, Ohio, specializes in advanced simulation technologies. The company focuses on providing high-fidelity simulations for complex physical phenomena, including plasma processes. AltaSim Technologies employs a team of experts in various fields of engineering and physics to deliver cutting-edge solutions for their clients. Their expertise in multiphysics simulations allows them to tackle challenging problems in industries such as semiconductors and electronics. By leveraging tools like COMSOL Multiphysics, AltaSim Technologies aims to enhance the development and optimization of advanced manufacturing processes. Read More
Solution	AltaSim Technologies has performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors for Maxwellian and non-Maxwellian cases using COMSOL Multiphysics. Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation as a preprocessing step to the numerical analysis of the plasma. Ion densities are shown in Figure 1 for a 1D simulation of a non-Maxwellian plasma. Extensions of the model to analyze the plasma behavior for a Maxwellian plasma in a 2D case are shown in Figures 2 and 3. The simulations incorporate the multiphysics nature of plasmas and consequently can be used to assist with the development of new CCP processing technology. Read More Log in to view content
Contents

Technology Category

Analytics & Modeling - Digital Twin / Simulation

Analytics & Modeling - Predictive Analytics

Applicable Industries

Semiconductors

Electronics

Applicable Functions

Product Research & Development

Use Cases

Process Control & Optimization

Digital Twin

Services

Software Design & Engineering Services

System Integration

Challenge

The multiphysics nature of plasmas presents enormous challenges for numerical simulations; analysis of the CCP process presents added difficulty due to the existence of a plasma sheath, the dynamic behavior of the plasma, and the large number of RF cycles required to reach a periodic steady state. Power deposition into the plasma is highly non-linear and the strong gradient of the electric field in the plasma sheath may lead to numerical instabilities unless a sufficiently fine mesh is applied. Typical CCP reactors may also contain sharp geometric corners that can cause a substantial local electric field that provide unphysical ion fluxes.

About Customer

AltaSim Technologies, based in Columbus, Ohio, specializes in advanced simulation technologies. The company focuses on providing high-fidelity simulations for complex physical phenomena, including plasma processes. AltaSim Technologies employs a team of experts in various fields of engineering and physics to deliver cutting-edge solutions for their clients. Their expertise in multiphysics simulations allows them to tackle challenging problems in industries such as semiconductors and electronics. By leveraging tools like COMSOL Multiphysics, AltaSim Technologies aims to enhance the development and optimization of advanced manufacturing processes.

Solution

AltaSim Technologies has performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors for Maxwellian and non-Maxwellian cases using COMSOL Multiphysics. Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation as a preprocessing step to the numerical analysis of the plasma. Ion densities are shown in Figure 1 for a 1D simulation of a non-Maxwellian plasma. Extensions of the model to analyze the plasma behavior for a Maxwellian plasma in a 2D case are shown in Figures 2 and 3. The simulations incorporate the multiphysics nature of plasmas and consequently can be used to assist with the development of new CCP processing technology.

Impact #1	AltaSim Technologies successfully performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors.
Impact #2	The simulations incorporated the multiphysics nature of plasmas, addressing the challenges posed by plasma sheaths and dynamic behavior.
Impact #3	Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation, enhancing the accuracy of the simulations.

Impact #1

AltaSim Technologies successfully performed one- and two-dimensional simulations of low-frequency RF discharges in axisymmetric CCP reactors.

Impact #2

The simulations incorporated the multiphysics nature of plasmas, addressing the challenges posed by plasma sheaths and dynamic behavior.

Impact #3

Electron transport properties and Townsend coefficients were calculated using the two-term Boltzmann approximation, enhancing the accuracy of the simulations.

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Overview

Capacitively Coupled Plasma Analysis

Operational Impact